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<p>  PGDM - Penang Advanced Packaging Materials Analysis Engineer page is loaded    <h3>PGDM - Penang Advanced Packaging Materials Analysis Engineer</h3>    Apply             locations  Malaysia, Penang         time type  Full time        posted on  Posted Yesterday        job requisition id  JR0248707        <h3><b>Job Details:</b></h3><h3>Job Description: </h3>Support Physical Failure analysis operations (setup/ buyoff and output matching, inline monitor, defect finding, yield improvement) for the factory. Coordinate the probing, sample prep and defect finding within TPT and Success rate benchmarks. Coordinate with existing FA Labs in Malaysia when tool leveraging is needed.Coordinate with DMO LYA VF forums to maintain CEPerform wafer level and die level sample preparation included cross section, lapping, dry and wet etching.Perform in SEM/FIB microscopy, EDX elemental analysis and dimensional measurement tasks.Engage Worldwide teams across functional area such as wafer fabrication, processing and testing.<h3><b>Qualifications:</b></h3>Chemical/ Materials/ Mechanical Deg/ Masters/ PhD.SEM/ TEM user experience in sample preparation, tool operation and layout/ circuit understanding. Statistical analysis, operational base an added advantage.<h3>Job Type:</h3>Experienced Hire<h3>Shift:</h3>Shift 1 (Malaysia)<h3>Primary Location: </h3>Malaysia, Penang<h3>Additional Locations:</h3><h3>Business group:</h3>As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.<h3>Posting Statement:</h3>All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.<h3>Position of Trust</h3>N/A<p><b>Work Model for this Role</b></p>This role will require an on-site presence.      <h3>Similar Jobs (5)</h3>     <h3>PGDM - Penang Advanced Packaging Material Analysis Technician</h3>        locations  Malaysia, Penang        time type  Full time        posted on  Posted 30+ Days Ago         <h3>PGDM - Penang Advanced Packaging Chemical Lab Technician</h3>        locations  Malaysia, Penang        time type  Full time        posted on  Posted 25 Days Ago               <h3>About Us</h3>     Intel provides reasonable accommodation to applicants and employees. For more information on our Reasonable Accommodation process, please click here .      <p>When you use this site, Intel Corporation uses cookies to improve your online experience. For more information, visit our <b>Cookie Notice</b> .</p><p>To view our candidate privacy notice, please click here .</p><h3>Need to change your email address?</h3><h3>Click on the Cloud icon beside your email address in the upper right-hand corner and select "Account Settings".</h3><h3> Important Note regarding your email change:  Remember to check the inbox of the email address you just updated to verify and complete the change. Verification is required before your account is changed to reflect the new email address.</h3>               </p>
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  PGDM - Penang Advanced Packaging Materials Analysis Engineer page is loaded    PGDM - Penang Advanced Packaging Materials Analysis Engineer    Apply             locations  Malaysia, Penang         time type  Full time        posted on  Posted Yesterday        job requisition id  JR0248707        Job Details:Job Description: Support Physical Failure analysis operations (setup/ buyoff and output matching, inline monitor, defect finding, yield improvement) for the factory. Coordinate the probi...

PGDM - Penang Advanced Packaging Materials Analysis Engineer

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Intel Corporation