Job Description

Job Summary

Responsible for investigating and determining root causes of hard disk drive failures across development, qualification, manufacturing, and field operations. This role focuses on electromechanical, magnetic recording, firmware, and media-related failures, and works cross-functionally to drive corrective and preventive actions that improve product reliability, quality, and customer satisfaction.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Provides verbal and written status including clear and accurate FA summaries and test reports to the Lead Engineer and the Department Manager.
• Maintain proper documentation of test procedures and results & update failure tracking databases and spreadsheets.
• Cross‑Functional Exposure:
  • Work closely with:
    • Failure Analysis Engineers (senior/principal)
    • Manufacturing and process engineering teams
    • Design and reliability engineering teams
  • Gain exposure to factory, lab, and NPI environments
  • Support internal FA reviews and technical discussions
• Perform structured root cause analysis (8D, 5-Why, Fishbone)
• Identify whether failures are:
  • Design-related
  • Process/manufacturing-related
  • Supplier-related
  • Usage or system-integration-induced
• Drive corrective and preventive actions (CAPA) with design, manufacturing, and suppliers
• Validate fixes through FA closure and re-testing

Job Requirements

REQUIRED:

• Bachelor’s degree or above in Electronic Engineering, Physics, or a related engineering discipline is required. 
• 0-2 years of relevant working experience; applications from fresh graduates are encouraged.

PREFERRED:

• Ability to read basic schematics and technical documentation
• Familiarity with laboratory equipment is an advantage
• Strong analytical and problem-solving mindset
• Willingness to learn complex HDD technologies
• Hands-on attitude and attention to detail
• Good written and verbal communication skills
• Able to follow structured troubleshooting steps
• Comfortable working in lab/factory environments
• Productivity tools such MS Office a must
• Proficient in programming languages such as C/C++, Python, and TCL; additional languages are an advantage.

SKILLS

• Technical Proficiency:
  • Semiconductor/device physics, materials science, and reliability engineering
  • Failure analysis techniques (e.g., Oscilloscope probe, multimeter usage, waveform analysis, trigger setting)
  • Root cause analysis methodologies (e.g. 8D, FMEA)
  • Knowledge of PCB, IC packaging, and microelectronics manufacturing processes
• Analytical & Problem-Solving Skills:
  • Data interpretation and correlation of electrical, mechanical, and material test results
  • Ability to identify, isolate, and resolve complex failure mechanisms
  • Statistical analysis and use of tools like Minitab, JMP, or MATLAB
• Soft Skills:
  • Strong communication for cross-functional collaboration and reporting
  • Attention to detail with a methodical, documentation-driven approach
  • Adaptability in fast-paced, high-priority investigation environments