At Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what’s next. To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others.

When you join Western Digital, you join a legacy more than 50 years in the making. Across our Western Digital®, SanDisk®, SanDisk® Professional, WD® and WD_BLACK™ brands, we have brought some of the most storied advancements in memory and data storage technology to market—and our best, most innovative work is yet to come.

From energizing gaming platforms, to enabling systems to make cities safer and cars smarter and more connected to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Here’s how you can help.

Senior Manager in this role will be responsible for researching, developing, and implementing innovative packaging solutions and requires a deep understanding of solid-state device physics, materials science, and packaging technologies, and expected to manage all aspects of packaging technologies required for Materials Center of Excellence (MCoE). Responsibilities encompass a wide range of tasks, from strategic planning to day-to-day operations, and require a combination of technical expertise, leadership skills, and problem-solving abilities. Candidate shall be specialized in advanced 3D & heterogenous packaging solutions, plays a critical role in ensuring successful and efficient implementation of next gen flash products.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Strategic Planning: Develops and implements long-term strategies on introducing advanced materials for solid-state device packaging to align with overall business objectives and market trends.
• Team Leadership: Manages and motivates a team of packaging engineers, technicians, and support staff.
• Material & Process Optimization: Identifies and implements advanced materials to be used in packaging processes to enhance efficiency, reduce costs, and improve performance and reliability of solid-state devices.
• Technology Evaluation: Assesses new packaging technologies and materials specifically designed for solid-state devices, such as advanced thermal management solutions and new gen 3D packaging techniques.
• Supplier Management: Oversees relationships with suppliers of packaging materials, equipment, and testing services tailored for SiP & Solid-state devices.
• Budget Management: Develops and manages budgets for Materials CoE Lab & path finding projects for next gen drives.
• Quality Control: Ensures that packaging operations adhere to strict quality standards and regulations specific to materials used in flash devices.
• Regulatory Compliance: Ensures compliance with relevant industry regulations and standards related to solid-state device packaging.
• New Product Introduction (NPI): Coordinates the introduction of new materials in packaging technologies and processes for SSD.

REQUIRED:

Candidate shall possess at least 15+ years of experience with a Master’s or PhD in materials science, electrical or mechanical engineering and preferably specialized in solid-state physics, semiconductor devices, and packaging technologies.

SKILLS:

• Leadership Skills: Ability to lead and motivate teams, build consensus, and make effective decisions.
• Problem-Solving Skills: Ability to identify and solve complex problems related to packaging solid-state devices.
• Project Management Skills: The ability to manage multiple projects simultaneously and deliver results on time and within budget.

• Communication Skills: The ability to communicate effectively with both technical and non-technical stakeholders.
• Office: Spending time in an office environment, planning, analyzing data, and communicating with colleagues.
• Manufacturing Floor: Visiting the manufacturing floor to inspect equipment, monitor processes, and troubleshoot problems related to solid-state device packaging.
• Supplier Facilities: Traveling to supplier facilities to evaluate new material technologies, processes and equipment specifically designed for packaging.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Western Digitals Ethics Helpline or email compliance@wdc.com