Job Description

1. Develop, evaluate and establish new semiconductor package solutions based on customer requirements, product specifications and emerging market trends.
2. Design, develop and optimize new processes, materials and packaging technologies to achieve targeted product performance, quality and reliability.
3. Lead and manage new technology development projects, including project planning, resource allocation, execution, timeline monitoring and cost control.
4. Collaborate with cross-functional teams, including R&D, Production, Process Engineering, Equipment Engineering and Quality, to ensure successful project implementation.
5. Conduct process characterization, validation, qualification and optimization to ensure process stability and product consistency.
6. Perform engineering experiments and trials to evaluate new materials, processes, equipment and technologies.
7. Analyse process data, identify technical issues and implement effective corrective and preventive actions to improve process performance.
8. Drive continuous improvement initiatives to enhance product quality, process efficiency, productivity and manufacturing yield.
9. Support new product introduction (NPI) activities and ensure smooth transition from development to mass production.
10. Coordinate technology transfer activities and provide technical support to manufacturing teams during production ramp-up.
11. Prepare and maintain technical documentation, including engineering reports, process specifications, qualification reports, experimental results and development records.
12. Monitor project progress, identify potential risks and provide regular updates on project status, technical challenges and development outcomes to management and customers.
13. Work closely with customers and internal stakeholders to understand technical requirements, resolve product-related issues and support new technology development.
14. Evaluate new technologies, materials and industry developments to identify opportunities for process innovation and competitive advantages.
15. Ensure all development activities comply with established quality management systems, safety standards, environmental requirements and company procedures.
16. Perform other engineering-related duties and special projects as assigned by management.

Job Requirements

1. Bachelor's Degree in Engineering, preferably in Electrical & Electronics, Mechanical, Materials Science, Chemical Engineering, Mechatronics or other relevant disciplines.
2. Fresh graduates are encouraged to apply. Candidates with relevant working experience in semiconductor manufacturing, process development or packaging technology will have an added advantage.
3. Basic understanding of semiconductor manufacturing processes, IC packaging technologies, materials and product development.
4. Knowledge of process engineering, statistical process control (SPC), Design of Experiments (DOE), Failure Analysis (FA) and engineering problem-solving methodologies will be an added advantage.
5. Familiarity with quality and reliability tools, process validation and qualification methodologies is preferred.
6. Strong analytical, technical and problem-solving skills with the ability to interpret engineering data and identify root causes.
7. Good project management, planning and organizational skills, with the ability to manage multiple projects and meet deadlines.
8. Proficient in Microsoft Office applications, particularly Excel, Word and PowerPoint. Knowledge of data analysis or statistical software will be an added advantage.
9. Good communication, presentation and interpersonal skills, with the ability to work effectively with cross-functional teams and customers.
10. Self-motivated, proactive and innovative, with a strong willingness to learn and explore new technologies.
11. Able to work independently with minimal supervision and collaborate effectively in a team-oriented environment.
12. Detail-oriented, adaptable and capable of working under pressure in a fast-paced semiconductor manufacturing environment.

Skills